Thermally conductive structure for dissipating heat in a portable electronic device
US10787014B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Sep 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.