Polymer and coating material
US10787590B2 · kind B2 · utility
0Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Dec 26, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2650/56
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.