Patent · US Active

Extrudable hot-melt pressure-sensitive adhesives for resealable packaging having improved organoleptic properties

US10787595B2 · kind B2 · utility

1Cited by
5References
19Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 7, 2015
Grant dateSep 29, 2020
Priority date—
Expiry dateJul 7, 2035

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2439/70
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

1) Hot-melt pressure-sensitive adhesive composition with MFI of 0.01 to 200 g/10 minutes and comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.