Electronic module housing for downhole use
US10787897B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2016 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Nov 23, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B49/08
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Methods, systems, devices, and products for downhole operations. Embodiments include downhole tools comprising an outer member configured for conveyance in the borehole; a pressure barrel positioned inside the outer member; a substantially cylindrical pod positioned inside the pressure barrel; and at least one downhole electronic component mounted between the exterior surface and the frame. The pod comprises at least one rigid outer surface forming an exterior surface of the pod and supported by a central frame extending across a diameter of the pod, such as a plurality of outer rigid surfaces. The pod may include a plurality of coupled rigid elongated semicircular metallic shells, wherein each shell of the plurality comprises a rigid outer surface of the plurality of outer rigid surfaces. Each of the at least one downhole electronic component may be sealingly enclosed within a corresponding shell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.