Component having a micromechanical sensor module
US10788387B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Mar 5, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Dec 4, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L27/002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor carrier having a main plane of extension, a first side parallel to the main plane of extension, a second side parallel to the main plane of extension, which is situated opposite the first side, and at least one electrical contact surface situated on the second side. At least one stress-measuring structure is embedded in the sensor carrier. A sensor module having such a sensor carrier as well as to a component having a sensor module having such a sensor carrier, are also described. A method for calibrating a sensor module and a method for operating a sensor module are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.