Cantilever microprobes for contacting electronic components

US10788512B2 · kind B2 · utility

Assignee

• Microfabrica Inc. · US

Inventors

• Richard T. Chen · Burbank, US
• Ezekiel J. J. Kruglick · San Diego, US
• Christopher A. Bang · San Diego, US
• Dennis R. Smalley · Santa Clarita, US
• Pavel B. Lembrikov · Santa Monica, US

Key dates

• Filing date: Apr 2, 2019
• Grant date: Sep 29, 2020
• Expiry date: Apr 2, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/07357
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.