Patent · US Active

Attachment method using anodic bonding

US10788793B2 · kind B2 · utility

0Cited by
2References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 29, 2016
Grant dateSep 29, 2020
Priority date
Expiry dateJul 26, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/326
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The invention relates to an anodic bonding method for bonding two elements with an intermediate layer. The invention especially, but not exclusively, relates to an anodic bonding method for between a metallic element and a heterogeneous element, for example a glass, artificial sapphire or ceramic element. The specificity and aim of the present invention is to produce an assembly that is gas-tight and fluid-tight, solderless, brazing- or welder-free and without organic compound (glue). The present method has multiple industrial applications, including making it possible to attach a watch-glass, typically made of mineral glass, sapphire or transparent or translucent ceramics, to a bezel or case middle of a watch case using the anodic bonding technique.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.