Flexible panel and manufacturing method thereof
US10788906B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Feb 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of the flexible panel is provided. Firstly, a carrier substrate is provided. Then, an adhesion layer is formed on the carrier substrate, a flexible substrate is formed on the adhesion layer, and a buffer layer is formed on the flexible substrate. Then, a device layer is formed on the flexible substrate. Next, a separating process is performed for separating the flexible substrate and the device layer from the carrier substrate. According to a relation between a thermal expansion coefficient of the flexible substrate and a thermal expansion coefficient of the carrier substrate, the manufacturing method of the flexible panel selects a pattern of the adhesion layer. The pattern of the adhesion layer includes a frame adhesion structure or a plane adhesion structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.