Aromatic resins for underlayers
US10790146B2 · kind B2 · utility
2Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2017 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Nov 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31138
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Aromatic resin polymers and compositions containing them are useful as underlayers in semiconductor manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.