Printed components on substrate posts
US10790173B2 · kind B2 · utility
18Cited by
82References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Dec 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/302
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.