Power semiconductor device comprising a power semiconductor component and a housing

US10790207B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Jörg Ammon · Erlangen, DE
• Harald Kobolla · Seukendorf, DE
• Stefan Weiss · Trostberg, DE

Key dates

• Filing date: May 17, 2019
• Grant date: Sep 29, 2020
• Expiry date: Jun 3, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/13091
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a power semiconductor device comprising a pin element which passes through a housing opening, comprising a support device, further comprising an elastic sealing device which is arranged on the support device, comprising a pressure device which is arranged on the sealing device, and comprising an electrically conductive sleeve. A first pressure element of the pressure device presses a first sealing element of the sealing device against a first support element of the support device in the axial direction of the pin element causes deformation of the first sealing element so that the first sealing element presses against the housing opening wall and against the sleeve in a perpendicular direction in relation to the axial direction of the pin element. A second pressure element of the pressure device is designed to press a second sealing element of the sealing device against a second support element of the support device in the axial direction of the pin element and in this way to cause deformation of the second sealing element in such a way that the second sealing element presses against the sleeve and against the pin element in a perpendicular direction in rela…