Discrete electronic component comprising a transistor
US10790249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2019 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Jun 23, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns a discrete electronic component including: a semiconductor chip including a transistor, the chip including a first metallization of connection to a first conduction region of the transistor; and a printed circuit board including first and second separate connection pads, wherein: the chip is assembled on the printed circuit board so that the first metallization of the chip is in contact with the first and second connection pads of the printed circuit board; and the assembly including the semiconductor chip and the printed circuit board is encapsulated in a package made of an insulating material leaving access to first and second connection terminals of the component connected, inside of the package, respectively to the first and second connection pads of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.