Array substrates, methods for manufacturing the same, and display screens
US10790313B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Jul 15, 2019 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Jul 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an array substrate. The array substrate includes a substrate; an outer connection wiring formed on the substrate. The outer connection wiring includes an outer connection section and a wire changing section located on an inner side of the outer connection section. An inorganic film covers the outer connection wiring. The inorganic film is provided with a via hole configured to expose a part of the wire changing section, and a groove configured to expose the outer connection section. And a metal layer is formed on the inorganic film, the metal layer includes a plurality of metal wirings electrically connected to the wire changing section through the via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.