Method of manufacturing a thin film encapsulation layer and organic light emitting diode display device
US10790472B2 · kind B2 · utility
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4References
20Claims
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Key dates
| Filing date | Sep 7, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Nov 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/10
Abstract
A method of manufacturing a thin film encapsulation layer includes providing a substrate provided with an organic light emitting diode (OLED) light emitting device; forming a barrier layer on the substrate, wherein the barrier layer surrounds the OLED light emitting device and includes an organic material having hydrophobic properties; forming a first inorganic encapsulation layer on the substrate, wherein the first encapsulation layer covers the OLED light emitting device; and removing the barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.