Carrier layout for an electro-optical module, an electro optical module using the same, and interconnect structure for coupling an electronic unit to an optical device
US10790568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2017 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Mar 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F30/223
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A carrier layout comprising a substrate comprising a ground plane layer and a coplanar waveguide interconnect disposed onto the substrate. The coplanar waveguide interconnect comprises a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The coplanar conductors of the pair are electrically connected to each other by at least one conducting island that is isolated from the ground plane layer. The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate having a ground plane layer, the interconnect structure comprising a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The conductors of the pair are electrically connected by at least one conducting island that is isolated from the ground plane layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.