Method for manufacturing a sensor provided with at least one ultrahigh-frequency antenna and ultrahigh-frequency sensor thus obtained
US10790581B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 9, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Feb 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/422
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a sensor having an ultra-high-frequency antenna printed on a receiving area on a first face of a printed circuit board. The first face of the board is inserted into a first housing portion with a seal and a compression element, the seal surrounding the receiving area while a first space remains free in the portion. A second face of the board is inserted into a second housing portion and the portions are pressed together, a second space remaining free. Then, polyurethane is injected into the first and second spaces, the seal preventing the polyurethane from penetrating into the receiving area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.