Systems and methods for heatsink to rail thermal interface enhancement
US10791652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Jun 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems (300) and methods (1200) for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.