Laser processing method and laser processing apparatus
US10792759B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Jan 26, 2015 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Feb 17, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/172
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.