Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
US10792785B2 · kind B2 · utility
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1References
8Claims
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Key dates
| Filing date | Jun 6, 2017 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Jan 8, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1472
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Described are slurry compositions useful in chemical-mechanical processing of a nickel layer of a substrate, wherein the slurry compositions contain abrasive particles that include silica particles that are cationically charged at a low pH.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.