Machine arrangement and method for sequential processing of sheet-type substrates
US10792910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2019 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Dec 17, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41P2217/11
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A machine arrangement, that sequentially processes sheet-type substrates, includes a plurality of different processing stations, one of which includes a non-impact printing device that prints the substrates. Further processing stations are a primer application device that primes the substrates and a dryer for drying the primer applied to the substrates. The primer application device and the dryer precede the non-impact printing device, in the direction of travel of the substrates. The processing station including the non-impact printing device, also includes a printing cylinder, on the circumference of which, the non-impact printing device that prints the substrates is arranged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.