Dual-cure resins and related methods
US10793745B2 · kind B2 · utility
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107References
21Claims
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Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Apr 5, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D175/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.