Patent · US Active

Polymer compositions and hot-melt adhesives formed therefrom

US10793757B2 · kind B2 · utility

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2References
16Claims
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Key dates

Filing dateNov 16, 2016
Grant dateOct 6, 2020
Priority date
Expiry dateMar 25, 2037

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02W90/10
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Predominately bio-sourced polymer compositions that may be used as hot-melt adhesives are disclosed herein. The polymer compositions may contain a polymer that has the following structure: G1 and G2 are independently (CH2)x. Variable x is an integer ranging between 1 and 10. Variable y is an integer ranging between about 50 and about 500. Variable z is an integer ranging between about 100 and about 600. Variable n is an integer ranging between about 5 and about 10,000. X is H, a functionalized alkylene polymer block containing alcohol functional groups, or a mixture thereof. Y is H, an acyl group, a functionalized alkylene polymer containing carboxylic acid functional groups, or a mixture thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.