Microelectromechanical component

US10794928B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Benny Pekka Herzogenrath · Wuppertal, DE
• Denis Gugel · Dußlingen, DE
• Rolf Scheben · Stuttgart, DE
• Rudy Eid · Stuttgart, DE

Key dates

• Filing date: May 9, 2018
• Grant date: Oct 6, 2020
• Expiry date: May 9, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0871
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A microelectromechanical component including, vertically at a distance from one another, a substrate device, a first, a second, and a third functional layer, a vertical stop being formed between the second and third functional layer, the vertical stop having a stop area on a surface of the second functional layer facing the third functional layer, wherein the second functional layer is connected to the first functional layer in a connecting area allocated to the stop area.