Using solid state deposition in the manufacture of data storage devices, and related devices and components thereof
US10796727B1 · kind B1 · utility
10Cited by
23References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2019 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | May 8, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to using solid state deposition to selectively and strategically manage one or more properties of one or more portions of a data storage device. Material deposited via solid-state deposition can be used to prepare a surface for subsequent treatment (e.g., welding), to join two or more substrates together, and/or to seal one or more joints or surfaces to control, e.g., the humidity in the interior of a data storage device. The present disclosure also involves related data storage devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.