OLED packaging method and OLED packaging structure
US10797264B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Jan 12, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An OLED packaging method and structure are disclosed. In the present invention, forming a ring-shaped organic layer on the edge of the inorganic barrier layer, and then forming a planar organic layer on the upper surface of the inorganic barrier layer surrounded by the ring-shaped organic layer. The planar organic layer and the ring-shaped organic layer are integrated together to form an organic buffering layer. The upper surface of the organic buffering layer is flat, and the region of the organic buffering layer corresponding to the edge position of the inorganic barrier layer does not have an upward projection, the film thickness and morphology of the inorganic barrier layer are not affected. The present invention can improve the barrier effect of inorganic barrier layer for water and oxygen. The upper surface of the organic buffering layer in the OLED packaging structure is flat and has a good encapsulation effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.