Package structure, manufacturing method for the same, and display device
US10797267B2 · kind B2 · utility
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2References
17Claims
0Family size
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Key dates
| Filing date | May 16, 2018 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | May 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present disclosure provides a package structure, a manufacturing method for the same, and a display device. The package structure includes a substrate, an organic light emitting device disposed on the substrate, and an encapsulation film layer disposed above the organic light emitting device, the encapsulation film layer encapsulating the organic light emitting device onto the substrate, wherein an adsorption structure is formed in the encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.