Patent · US Active

Method for manufacturing camera modules and a camera module array

US10798277B2 · kind B2 · utility

1Cited by

0References

12Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Anne Bochow · Echterdingen, DE
Adrian Severin Matusek · Leinfelden, DE
Alexander Fischer · Aachen, DE
Andreas Reppich · Leonberg, DE
Andreas Kugler · Alfdorf, DE
Istvan Denes · Rutesheim, DE

Key dates

Filing date	Sep 17, 2018
Grant date	Oct 6, 2020
Priority date	—
Expiry date	Feb 15, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH04N23/57
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a camera module, the camera module including a circuit carrier, an image sensor and an optical system holder, including: mounting the image sensor on the circuit carrier; applying a protective layer to the circuit carrier, in which the image sensor is not covered by the protective layer and the protective layer simultaneously forms the optical system holder.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.