Systems and methods for implementing intelligent cooling interface archiectures for cooling systems
US10798851B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 24, 2019 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | May 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4735
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided to implement intelligent cooling interface architectures for cooling systems that employ a heat transfer interface between multiple separate coolant circulation loops. A heat transfer interface may be advantageously managed based on monitored real time operational parameters (e.g., operating conditions such as pressures, mass flow rates, temperatures, etc.) within one or more of the separate coolant loops. Diagnostics and prognostics may be performed to verify proper cooling system operation and to detect out-of-specification operational parameters based on expected or acceptable levels for these measurements in view of the heat load to be removed. In this way, the cooling system performance may be monitored to ensure proper operation and to anticipate and alert a user when cooling system operation is trending toward a failure condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.