Laser processing system and method of use
US10799981B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2016 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Nov 12, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing system includes a metal platform having a metal surface wherein at least a portion of the platform surface is substantially planar with a substantially smooth topography. A laser source is configured to generate a laser beam having a focal point that is directed toward a substantially planar portion of the platform surface. A motion mechanism is configured to move at least one of the metal platform and the focal point along at least one axis. A restraining mechanism restrains a film against the platform surface such that an adjoining surface of the restrained film remains in intimate contact with the surface. A controller is configured to operate the laser source, the motion mechanism or both to cut the restrained film in a predetermined pattern with a generated laser beam such that the cut does not extend through the adjoining surface of the restrained film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.