Low temperature atmospheric pressure plasma for cleaning and activating metals
US10800092B1 · kind B1 · utility
5Cited by
21References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2018 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Jul 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H2242/26
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Plasma applications are disclosed that operate with argon or helium at atmospheric pressure, and at low temperatures, and with high concentrations of reactive species in the effluent stream. Laminar gas flow is developed prior to forming the plasma and at least one of the electrodes can be heated which enables operation at conditions where the argon or helium plasma would otherwise be unstable and either extinguish, or transition into an arc. The techniques can be employed to clean and activate a metal substrate, including removal of oxidation, thereby enhancing the bonding of at least one other material to the metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.