Lamination molding apparatus
US10800100B2 · kind B2 · utility
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1References
9Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 11, 2019 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Dec 11, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A lamination molding apparatus includes a molding table, a molding table driver, and a chuck. The molding table includes a molding region and a temperature adjusting unit. In the molding region, a desired three-dimensional molded object is formed. The temperature adjusting unit has a heating unit with a heater, and a cooling unit with a cooler. The heating unit and the cooling unit are arranged to be stacked in a vertical direction. The molding table driver moves the molding table in the vertical direction. The chuck detachably fixes the temperature adjusting unit to the molding table driver at one fixing point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.