Patent · US Active

Release layer including at least one fluorosilicon compound

US10800947B2 · kind B2 · utility

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0References
16Claims
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Key dates

Filing dateMay 10, 2017
Grant dateOct 13, 2020
Priority date—
Expiry dateSep 6, 2037

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2483/005
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Various embodiments disclosed related to a release layer including at least one fluorosilicon compound, and to related aspects such as methods for display device substrate processing. In various embodiments is a method of processing a display device substrate. The method can include securing the display device substrate to a carrier substrate with an adhesive delamination layer and a release layer between the adhesive delamination layer and the display device substrate. The release layer includes a cured product of a precursor release layer composition. The precursor release layer composition includes at least one fluorosilicon compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.