Polyurethane hot melt adhesive based on polyacrylates with high heat resistance

US10800957B2 · kind B2 · utility

Assignee

• SIKA TECHNOLOGY AG · CH

Inventors

• Martin Schmider · Glückstadt, DE
• Kai Paschkowski · Jork, DE
• Jörg PLAUMANN · Hamburg, DE

Key dates

• Filing date: Dec 21, 2016
• Grant date: Oct 13, 2020
• Expiry date: Feb 8, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2301/408
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Solvent-free polyurethane hot melt adhesives which can be obtained by reacting a composition including a polyether polyol, a polyester polyol, at least one poly(meth)acrylate, and one or more fillers, selected from kaolin, fumed silica, soot, and wollastonite, with a polyisocyanate. In comparison to similar adhesives without a filler content, the adhesives are characterized by significantly improved heat resistance properties while the remaining properties are comparable. Furthermore, in some cases, improved mechanical properties, such as an improved tear strength, could be observed by adding the fillers. The aforementioned hot melt adhesive compositions are therefore suitable in particular for applications in automotive construction, in the textile industry, and in the packaging industry, and in particular for adhering sandwich panels.