Low-dust products using a wax emulsion
US10801217B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 29, 2016 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | May 11, 2038 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F21/165
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound that comprises a dust-reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust-reduction additive also synergistically imparts water resistance and adhesion to the wall repair compounds to which it is added. More specifically, in one embodiment, the dust-reduction additive is an emulsion comprising colloidally-protected, wax-based microstructures comprising paraffin that is chemically encapsulated by polyvinyl alcohol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.