Information handling system thermally conductive hinge
US10802555B2 · kind B2 · utility
10Cited by
47References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2018 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Feb 19, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.