Vacuum transfer device and a method of forming the same
US10804134B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2019 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Feb 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.