Multi-chip module and method for manufacturing same
US10804190B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 13, 2016 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Sep 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10492
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.