Method for manufacturing chip cards and chip card obtained by said method
US10804226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2017 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | May 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80801
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a chip card manufacturing method. According to this method, there are produced on the one hand, a module including a substrate supporting contacts on one face, and bonding pads on the other, on the other hand, an antenna on a support. The ends of the antenna are linked to lands of connection lands receiving a drop of soldering material on a connection portion. In order to make the soldered electrical connection between the module and the antenna reliable, the bonding pads extend over a zone covering a surface area less than that of the connection portions. The invention relates also to a chip card whose module includes bonding pads extending over a zone covering a surface area less than that of the connection portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.