Method of mounting conductive ball
US10804240B2 · kind B2 · utility
0Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2019 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Jun 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.