Chip-on-board display module, manufacturing method thereof, light-emitting diode device and manufacturing method thereof
US10804250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2017 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Oct 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.