Bonded-magnet injection molding device and bonded-magnet injection molding method
US10804776B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2018 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Dec 15, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2995/0008
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An injection molding device includes: a lower die that supports a rotor core; an intermediate die including a magnetizing mechanism; and an upper die including an injection die having a gate formed therein through which a molten bonded-magnet material supplied from a supply source is injected into a magnet insertion hole in the rotor core. The injection die has a cylindrical protruding portion at an end surface of which the gate is open. In the protruding portion, a magnetic-flux applying member containing ferromagnetic material is embedded with its side surface exposed at an outer peripheral surface of the protruding portion. The magnetizing mechanism is formed in an annular shape that can accommodate, inside its inner periphery, the rotor core and a distal end portion of the protruding portion by disposing yokes and permanent magnets alternately in the circumferential direction. Magnetic-path surfaces of the yokes radially face the side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.