Heat dissipation apparatus and communications device
US10804783B2 · kind B2 · utility
3Cited by
6References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 2, 2018 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Nov 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K33/02
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention provide a heat dissipation apparatus. Wherein a loop coil is disposed on a swing plate. A first magnet and a second magnet are located on two sides of the loop coil, and when a current whose direction periodically varies flows through the loop coil, an Ampere force whose direction periodically varies is applied to the loop coil under an action of a magnetic field formed by the first magnet and the second magnet, so that the loop coil drives the swing plate to swing back and forth. The present invention is used for heat dissipation of a micro electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.