Patent · US Active

Modified PCB vias to prevent burn events

US10806026B2 · kind B2 · utility

0Cited by

22References

7Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Matthew S. Doyle · Chatfield, US
Joseph Kuczynski · North Port, US
Jeffrey N. Judd · Oronoco, US
Scott D. Strand · Rochester, US
Timothy J. Tofil · Rochester, US

Key dates

Filing date	Sep 9, 2019
Grant date	Oct 13, 2020
Priority date	—
Expiry date	Sep 9, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1178
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.