Method and apparatus for manufacturing a mechatronic system by three-dimensional printing
US10807301B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Jun 19, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3493
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Method for manufacturing a mechatronic system comprising: a step of manufacturing a mechanical structure (SM) by three-dimensional printing by fused filament deposition of at least one first electrically insulating material (M1), and a step of manufacturing at least one electrical component (CE) in contact with at least one element of said mechanical structure and secured therewith; characterized in that said step of manufacturing at least one electrical component is implemented by three-dimensional printing by fused filament deposition of at least one second material (M2), conductive or resistive, directly in contact with said element of the mechanical structure. Apparatus for implementing such a method. Mechatronic system that can be manufactured by such a method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.