Patent · US Active

Die cut opening for multi-layer flexible package

US10807779B2 · kind B2 · utility

0Cited by
14References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 5, 2019
Grant dateOct 20, 2020
Priority date
Expiry dateMar 5, 2039

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1082
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

A reclosable package is described that includes inner and outer film layers. Each of the inner and outer film layers includes die cuts that are designed to create a peelable flap portion that, when pulled back by the user, reveals an opening of the package for providing access to the contents of the package. In particular, the inner film layer has an inner die cut that includes a cross-directional cut line. While the cross-directional cut line in conventional packages is a straight line, the package described herein uses a line that has one or more radii of curvature. In this way, the vibrations that may otherwise be generated during the rotary die cutting process are reduced, and more consistent cut depths can be achieved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.