Curable adhesive compound and reactive adhesive tapes based thereon

US10808153B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Thilo Dollase · Hamburg, DE
• Markus Brodbeck · Stuttgart, DE
• Alexander Fischer · Bad Homburg vor der Höhe, DE
• Marco Kupsky · Quickborn, DE
• Matthias Koop · Norderstedt, DE

Key dates

• Filing date: Apr 18, 2017
• Grant date: Oct 20, 2020
• Expiry date: Apr 18, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J179/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.