Methods of grinding semiconductor nanocrystal polymer composite particles
US10808169B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 10, 2017 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Mar 3, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/3615
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of grinding a semiconductor nanocrystal-polymer composite, the method including obtaining a semiconductor nanocrystal-polymer composite including a semiconductor nanocrystal and a first polymer, contacting the semiconductor nanocrystal-polymer composite with an inert organic solvent; and grinding the semiconductor nanocrystal-polymer composite in the presence of the inert organic solvent to grind the semiconductor nanocrystal-polymer composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.