Electronic devices with modular housings
US10808963B2 · kind B2 · utility
3Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2019 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Jan 11, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/70
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A sensor device including a housing and a number of sensors. The housing includes a back plate including a mounting surface, a middle plate attached to the back plate, and a face plate attached to the middle plate, wherein the face plate is formed from a clear material and has a back surface and a front surface with the back surface positioned toward the middle plate and wherein a design is applied to the back surface of the face plate and is visible through the front surface of the face plate. The housing defines an interior housing volume and the number of sensors is positioned within the interior housing volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.