Adiabatically coupled photonic systems with fan-out interposer
US10809456B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2019 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Mar 28, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic system may include a PIC and an interposer. The PIC may include a first SiN waveguide. The interposer may include second and third SiN waveguides substantially vertically aligned with the first SiN waveguide in an overlap region of a first waveguide stack that may include the first, second, and third waveguides in the first waveguide stack. Within the overlap region, the second SiN waveguide may include vertical tapering that increases a thickness of the second SiN waveguide from an initial thickness to an increased thickness toward the first SiN waveguide. The first waveguide stack may further include a non-overlap region in which the interposer does not overlap the PIC. The non-overlap region may include the second and third SiN waveguides. Within the non-overlap region, the second SiN waveguide may maintain the increased thickness and the second and third SiN waveguides may include a first lateral bend.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.