Photonic integrated circuit
US10809473B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2017 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Dec 15, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit comprises a substrate and a passive layer, which is formed on the substrate and incorporates a passive photonic device. The circuit also comprises a layer of III-V material. The layer of III-V material is arranged in a recess of the passive layer and incorporates an active photonic device. The layer of III-V material is configured such that light can be transferred between the passive photonic device and the active photonic device. This photonic integrated circuit provides the advantages of an active device formed from III-V material in an arrangement that is easily planarized, which enables close integration between the active device and electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.